水射流技术及工程应用
上QQ阅读APP看本书,新人免费读10天
设备和账号都新为新人

参考文献

[1] 雷玉勇,万霞.高速水射流特种精密加工技术.精密制造与自动化,2003(增刊):138-142.

[2] 雷玉勇,杨桂林,贾强.绿色制造技术与装备.机械与电子,2005(增刊):27-33.

[3] 雷玉勇,唐川林等.超高速脉冲水射流技术的研究及应用.矿山机械,30(12):8-12.

[4] 杨桂林,雷玉勇等.磨料水射流微细雕刻技术.西华大学学报,2006,25(3): 92-95.

[5] 李荣钟,雷玉勇.水射流特种加工技术.中国测试技术,2007,33(4): 37-40.

[6] 蔡黎明,雷玉勇等.水射流导引激光在微细加工中的应用.微细加工技术,2008.10(5):60-64.

[7] 雷玉勇,蔡黎明等.微磨料水射流技术及应用.西华大学学报,2009,28(4):1-6.

[8] 雷玉勇,蒋代君,刘克福等.微磨料水射流三维加工的试验研究.西华大学学报,2010,29(2):7-10.

[9] 袁卓林,雷玉勇等.微磨料水射流对工件表面抛光作用的研究.机床与液压,2010,38(21):4-6.

[10] 戴良博,雷玉勇等.冰粒射流除锈试验研究.煤矿机械,2010,31(8):101-103.

[11] 万庆丰,雷玉勇,基于微磨料水射流的刀具钝化模型研究.现代制造工程,2013,9:95-99.

[12] 卢义玉等.空化水射流-双氧水处理苯酚废水的机理分析.重庆大学学报,2008,31(10):1164-1168.

[13] 孙家俊.水射流切割技术.徐州:中国矿业大学出版社,1992.

[14] Momber A.W.,Kovacevic R.Principles of Abrasive Water Jet Machining[M]. Springer-Verlag,London,appears,1998.

[15] Larry L.Pater.Experiments With A Cumulation Pulsed Jet Device.8th Symposium on Jet Cutting Technology,9th –11th Semptember,1986,Durham,England.

[16] Jeffrey D.Watson.Ultrahigh-velocity Waterjets.Proceedings of the 7th American water jet conference,Aug.28-31,1993,Seattle,Washington.

[17] N.Dushkina,B.Richerzhagen.Dicing of GaAs Wafers with Synova Laser Microjet[R].Challenges,Improvements and Safety Issues,Technical Digest,ICALEO94,2002.

[18] Yang Zhen,Lei Yuyong,Zou Hu,Lv Hua,Jia Weiguang.Experiments on Preparation of Cutting Tool Edge Using Abrasive Water Jet.Advanced Materials Research,2011,337: 146-150.

[19]Miller,D.S.Micromachining with Abrasive Waterjets[J].Journal of Material process,2004,149(1-3):37-42.

[20] Miller,D.S.Micromachining with Abrasive Waterjets[C].Proceedings of the 16th International Conference on Water Jetting.BHR GroupLtd.,Cranfield,UK,2002.

[21] Miller,D.S.Micro Abrasive Waterjet Cutting[C].Proceedings of the 2001 WJTA American Waterjet Conference,Minneapolis,USA,2001.

[22] Miller,D.S.New Abrasive Waterjets to Compete with Lasers[C].Proceedings of the 2005 WJTA American Waterjet Conference,Houston.Texas,USA,2005.

[23] Mohamed Hashish.Abrasive Waterjet Cutting of Microelectronic Components[C].Proceedings of the 2005 WJTA American Waterjet Conference,Houston.Texas,USA.2005.

[24] Miller,D.S.Strategies for Introducing New Abrasive Waterjet Technologies[C].Proceedings of the 2005 WJTA American Waterjet Conference,Houston,2005.

[25] Miller,D.S. Micro Abrasive Waterjet (MAWs)[C]. Proceedings of the 1999 WJTA American Waterjet Conference,Houston,Texas,USA.1999.

[26] Hashish,M.The Waterjet as a Tool[C].Proceedings of the 14th International Conference on Water Jetting.BHR GroupLtd.,Brugge,Belgium,1990.

[27] Miller,D.S.Paradigm Shifts in Abrasive Waterjet Technologies[C].Proceedings of 18th International Conference on Water Jetting Gdansk,Poland,September 2006.

[28] Miller,D.S. Development of Micro-abrasive Waterjets[C].Proceedings of the 15th International Conference onWater Jetting.BHR GroupLtd.,Cranfield,UK.2000.